Careers
Or Akiva, Israel
About HighSecLabs (HSL)
HSL (High Security Labs), located in Or Akiva, Israel, is looking for a Microelectronics Assembly Technician – Wire Bonding to join our team.
Requirements
- Previous hands-on experience operating Wire Bonding machines – Required.
- Experience working with microscopes and performing delicate, high-precision tasks.
- Strong attention to detail, accuracy, responsibility, and the ability to work independently.
- Familiarity with microelectronics manufacturing or electronic assembly processes – Advantage.
- Experience working in a cleanroom environment – Advantage.
- Experience in the defense industry – Advantage.
Key Responsibilities
- Perform high-precision Wire Bonding processes.
- Set up Wire Bonding equipment and switch production programs according to manufacturing requirements.
- Work with microscopes and perform visual inspections to ensure product quality.
- Identify basic equipment or process issues and report them to the relevant teams.
- Document production processes and complete manufacturing reports.
- Follow quality assurance, safety, and manufacturing procedures.
- Collaborate closely with Production, Engineering, and Quality teams.
This position is open to all qualified candidates.